Method for mating a device with a substructure

ABSTRACT

A device to be detachably attached to a mechanical substructure includes rails on opposed sides joined at the front by a cross member. A pair of guides mounted on the substructure slidably receives and retains the rails upon attachment of the device. An alignment pin extending from a rail mates with a hole in one of the guides to insure alignment of an electrical connector of the device with an electrical connector mounted on the substructure. The cross member includes screws for securing the cross member to the substructure. A spring extending from a rail makes electrical contact with an adjacent guide and an electrostatic discharge contact plate to discharge any existing static charge.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application is a divisional application of a patentapplication entitled “Mating Assembly for an OEM Device” filed Sep. 30,2002 and assigned Ser. No. 10/260,915 now U.S. Pat. No. 6,716,035. Thisapplication relates to subject matter disclosed in a provisionalapplication entitled “Rail and Guide for a Device”, filed Jun. 7, 2002and assigned Ser. No. 60/386,977.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to mating assemblies and, moreparticularly, to a guide assembly for mechanically supporting andelectrically connecting a rail mounted device.

2. Description of the Related Prior Art

Various mechanical substructures, such as printed wiring boards andother mechanical devices provide support for detachably attached devicesof various sorts that are electrically connected to elements attendantthe mechanically substructure. No industry standard presently exists formounting such devices on the mechanical substructure. Accordingly,provisions must be made unique to each device to mount same.Furthermore, the electrical interconnections vary widely in type andusually require manual engagement. The potential for substantial damagedue to static electricity to components mounted on the mechanicalsubstructure or components of a device being mounted exists. Todissipate any electrostatic charges, known procedures must be employedbut the carrying out of such procedures is sometimes omitted withattendant actual or potential damage to one or more components.

SUMMARY OF THE INVENTION

The present invitation relates to guides mounted upon a mechanicalsubstructure for engaging the corresponding rails attached to a deviceto be demountably mounted upon the mechanical substructure. Thealignment of the device with components of the mechanical substructureis assured through predetermined interconnection and alignment betweenthe guides and the rails. Such alignment permits mating betweenelectromechanical connectors attendant the device and the mechanicalsubstructure. Elements interacting between the guides and the railsassure dissipation of any electrostatic charges and a zero staticpotential upon mounting of the device to preclude damage to theelectrical components from static electricity. The cooperativeengagement between the guides and the rails eliminates the need formanual access to make further mechanical or electrical connections andthereby permit a low profile mechanical packaging enclosure commensuratein size with the device.

It is therefore a primary object of the present invention is to providea guide and rail assembly for mating and electrically connecting adevice to a mechanical substructure.

Another object of the present invention is to provide an industrystandard assembly for demountably mounting electromechanical devices ona mechanical substructure.

Still another object of the present invention is to provide a matingassembly which dissipates any existing electrostatic charges during themating procedure.

Yet another object of the present invention is to provide a matingassembly which eliminates the need for manual mechanical connection andengagement of mating electrical conductors.

A further object of the present invention is to provide rails attachableto any device, or a housing therefor, for engagement with guides mountedon the mechanical substructure to which the device is to be mechanicallyand electrically connected.

A yet further object of the present invention is to provide a method formating and electrically connecting a device in alignment with amechanical substructure.

A still further object of the present invention is to provide a methodfor electrostatic dissipation upon mechanical and electrical attachmentof a device to a substructure.

These and other objects of the present invention will become apparent tothose skilled in the art as the description thereof proceeds.

DESCRIPTION OF THE DRAWINGS

The present invention will be described with reference to the followingdrawings, in which:

FIG. 1 is a perspective view of the present invention used inconjunction with a device to be attached to a mechanical substructure;

FIG. 2 is an exploded view of rails to be attached to a device;

FIG. 3 is an exploded view of rails and electrostatic discharge contactplates supported on the substructure; and

FIG. 4 is a cross-sectional view taken along lines 4—4, as shown in FIG.1.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring to FIG. 1, there is shown a substructure 10 used as a mountingfor various electrical, electromechanical and mechanical elements. Thesubstructure may be removable from a chassis of signal processingequipment. Generally, substructure 10 and the elements forming a partthereof will constitute a component of a unit wherein signal processingis performed. Accordingly, substructure 10 may incorporate clasps 12 and14 for detachably attaching the substructure to the unit. Moreover, thesubstructure may include various electromechanical connectors 16disposed along rear edge 18 for electrically engaging other componentsof the signal processing equipment. Although not shown, variouselectrical components, such as integrated circuits transistors,resistors, capacitators, inductors, microprocessors, etc., may bemounted on the substructure.

Removably mounted electromechanical devices, such as media storagedevices, hard disc drives, etc., may be mounted upon substructure 10 inconformance with the present invention. Device 20 is illustrated in FIG.1 as being mechanically mounted upon the substructure and electricallyconnected thereto in conformance with the present invention. Device 22is illustrated in FIG. 1 just prior to mounting same on substructure 10.A pair of rails 30, 32 are attached to each of devices 20, 22 or to ahousing 24 for one of devices 20, 22. The rails are secured to opposedsides and include a cross member 34 containing securing means forsecuring the rail supported device to substructure 10. A pair of screws36 penetrably engage cross member 34 for threaded engagement withapertured holes in faceplate 56, of which hole 38 is illustrated, toretain device 22 secured to substructure 10. A pair of guides 40, 42 aremounted upon substructure 10 to slidably receive rails 30, 32,respectively to accurately position the rail supported device upon thesubstructure. An electrical connector 44 is mounted on substructure 10for mating with a corresponding electrical connector 45 disposed at therear end of device 22.

Referring jointly to FIGS. 2, 3 and 4, further details of rails 30, 32,cross member 34, and guides 40, 42 will be described. Rail 32 is securedto one side of device 22 by bolts or machine screws 46 penetrablyengaging corresponding apertures 48 in the rail and threadedly engagingdevice 22 or a housing 24 of the device. To insure dissipation of anyelectrostatic charge attendant device 22, a spring 50 is retained byrear bolt 46 within a slot 52 formed in rail 32. The spring is bentoutwardly to protrude beyond the surface of rail 32, as illustrated inFIG. 1, to insure engagement of the spring with plates 96, 98 (see FIG.3) upon insertion of device 22 through aperture 54 in faceplate 56attendant substructure 10. Thereby, as device 22 is slid throughaperture 54 the spring makes an ongoing sliding electrical contact withplates 96, 98 to insure discharge of static electricity prior toengagement with electrical connector 44. Rail 30 is secured to theopposite side of device 22 or to housing 24 of the device by furtherbolts or machine screws 46 penetrably inserted through apertures 58 intothreaded engagement with aperture 60. Rail 30 includes an alignment pin62 for snug engagement with a receiving hole 64 disposed at the end ofrail 40. Cross member 34 is secured to the ends of rails 30, 32 by boltsor machine screws 66 penetrably engaging respective apertures 68 and inthreaded engagement with threaded holes 70, 72 at the ends of rails 30,32, respectively.

Guides 40, 42 are essentially duplicates of one another and will bedescribed with particular reference to FIGS. 3 and 4. These guides areattached to substructure 10 in a conventional manner parallel with oneanother and spaced apart a predetermined distance commensurate thespacing between rails 30, 32. Each guide is formed with a T-shaped crosssection, as illustrated, whereby each upstanding leg 80 and 82 of guidesrails 30 and 32 supports one of laterally extending overhangs 84 and 86engaging the top surfaces of rails 30, 32 to prevent unwanted verticalmovement. Upon insertion of device 22 (or housing 24), pin 62, extendingfrom rail 30, engages aperture 64 of guide 40 to insure that electricalconnector 45 at the rear of device 22 is in vertical and lateralalignment with electrical connector 44.

Each rail may include one or more slots 90, 92 coincident with recessesdisposed in upstanding leg 82. Recess 94 aligned with slot 90 isillustrated in FIG. 4. A pair of electrostatic discharge contact plates96, 98 are mechanically attached to substructure 10 and electricallygrounded therewith. Each of these plates is lodged within acorresponding one of recesses 94. The primary purpose of plates 96, 98is that of serving as an electrostatic discharge contacts and is engagedby spring 50 (see FIGS. 1 and 2) as device 22 is inserted throughfaceplate 56 of substructure 10.

It is intended that the guide and rail apparatus described above be inthe nature of an industry standard to permit removable mounting of anyof various devices upon a substructure. To meet this goal, each device22 must be adapted for attachment of rails 30, 32 and include anelectrical connector 45 commensurate with connector 44. Alternatively, adevice to be mounted may be lodged within a casing or housing 24configured for attachment of rails 30, 32, which housing would include aconnector 45 commensurate with connector 44.

While the invention has been described with reference to severalparticular embodiments thereof, those skilled in the art will be able tomake the various modifications to the described embodiments of theinvention without departing from the true spirit and scope of theinvention. It is intended that all combinations of elements and stepswhich perform substantially the same function in substantially the sameway to achieve the same result are within the scope of the invention.

1. A method for detachably attaching a device to a substructure, saidmethod comprising the steps of: a) attaching a pair of rails to opposedsides of the device; b) slidably engaging the pair of rails with a pairof guides mounted on the substructure; c) aligning an alignment pinextending from one rail of the pair of rails with a hole in one guide ofthe pair of guides to align an electrical connector of the device withan electrical connector mounted on the substructure; d) securing a crossmember interconnecting the pair of rails with a face plate attached tothe substructure to secure the device with the substructure; e)dissipating any attendant electrostatic charge upon execution of saidstep of sliding, wherein said step of dissipating includes the step oftranslating a spring extending from a rail of the pair of rails alongthe corresponding one guide of the pair of guides; and f) contacting aplate extending from the substructure with the spring during executionof said step of translating.
 2. The method as set forth in claim 1including the step of contacting the plate extending from thesuperstructure with the spring during extension of said step oftranslating.
 3. A method for detachably attaching a device to asubstructure, said method comprising the steps of: a) attaching a pairof rails to opposed sides of the device; b) slidably engaging the pairof rails with a pair of guides mounted on the substructure; c) aligningan alignment pin extending from one rail of the pair of rails with ahole in one guide of the pair of guides to align an electrical connectorof the device with an electrical connector mounted on the substructure;d) dissipating any attendant electrostatic charge upon execution of saidstep of engaging, wherein said step of dissipating includes the step oftranslating a spring extending from a rail of the pair of rails alongthe corresponding one guide of the pair of guides; and e) contacting aplate extending from the substructure with the spring during executionof said step of translating.
 4. The method as set forth in claim 3including the step of contacting the plate extending from thesuperstructure with the spring during extension of said step oftranslating.
 5. A method for detachably attaching a device to asubstructure, said method comprising the steps of: a) attaching a pairof rails to opposed sides of the device; b) slidably engaging the pairof rails with a pair of guides mounted on the substructure; c) securinga cross member interconnecting the pair of rails with a face plateattached to the substructure to secure the device with the substructure;d) dissipating any attendant electrostatic charge upon execution of saidstep of engaging, wherein said step of dissipating includes the step oftranslating a spring extending from a rail of the pair of rails alongthe corresponding one guide of the pair of guides; and e) contacting aplate extending from the substructure with the spring during executionof said step of translating.
 6. The method as set forth in claim 5including the step of contacting the plate extending from thesuperstructure with the spring during extension of said step oftranslating.